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Preparation of Organosilicon Modified Phenolic Enzymatic Resin

May 30, 2023

Example of Preparation of Organosilicon Modified Phenolic Enzymatic Resin

(1)The adhesive used for copper foil insulation board is suitable for bonding copper pins and phenolic resin laminates with silica fired modified phenolic resin. It can be prepared from soluble phenolic resin, silicone coupling agent, polyvinyl alcohol succinase, and organic solvents; For example, press 640g C6 into OH, 400g HCHO, and 4 4g Zn (OAc) 2, heated and refluxed, dehydrated for 6 hours. Then dilute with 12.2g MeOH to obtain a linear phenolic resin with a solid content of 80% (containing free C6 to OH 5 8%, containing 29% C-pressure OCH2 base. Take out 13 portions of linear phenolic resin, 9 6 portions of polyvinyl alcohol butyric cheese with an average polymerization degree of 2500, o 1 part pressure NC2 compared to NHC3H heart (OMe=and 77 Mix 8 parts of solvent into adhesive. Apply it to the copper flute. After drying, place the copper filling on a laminated board made of 8 layers of phenolic resin impregnated paper and cure it under pressure at 150 ° C for 60 minutes. The resulting laminated product has a peel strength of 0 22MPa, welding resistance time 28s.

(2) The water-based modified phenolic resin coating contains organic silicon compounds with a burning oxygen group, which is easy to react with organic compounds containing light groups. That is, PF reacts with organic silicon monomers containing a burning oxygen group to form a three-dimensional network with a silicon oxygen bond structure:
There is a competitive reaction of phenol self polymerization during the reaction process, so the competitive polymerization between the two reactions becomes the key to the success or failure of the modification. After curing, a silicone oxygen fired modified phenolic resin coating with excellent wear resistance and acid resistance that can be diluted with water can be prepared from phenolic resin, colloidal silica, RSi (OR is hydrolysate and solvent), etc. For example, 1 5g 34% silicon dioxide water lotion (particle size: 20nm, specific surface area: 150m2/g), 5g 51% 53% phenolic resin with average molar mass of 200 250g/mol, 4g MeSi (OMe) 3, 0.8g AcOH, 2.7gi PrOH and 8g BuOC Wei OH. The coating obtained through mixing reaction is coated on glass, polycarbonate or aluminum plate, and cured at 110 ° C to obtain a transparent and hard coating with a thickness of 2-10 µ m.

(3) The addition of silica fired micro powder into phenolic resin, which is an anti cracking phenolic resin molding material, can effectively improve its anti cracking performance. The silica fume used is composed of 100 parts by mass of MT silicone resin with a viscosity of 350mPa • s (25 ° C) and a vinyl group [containing Me core 005 chain segment 35 (mol)%, MeSi01.s chain segment 63 (mol)%, and ViMe core 005 chain segment 2 (mol)%], 3 parts of methyl hydrogen silicone oil, and a small amount of PtCl4 pressure PrOH catalyst (calculated based on silica fume, Pt dosage is lOX10-6), and 0 1 part of 3-methyl-4-butanediol (inhibitor) was reacted at 100 ° C for 3 hours to obtain solid silica fume, which was ground and sieved through a 100 mesh sieve to obtain ultrafine powder. Then take out 6 portions, add 30 portions of linear phenolic resin (with a softening point of 80 ° C and a light base equivalent value of 100), 70 portions of silica, 4 portions of hexamethylene tetramine, and 1 portion of Brazilian palm wax, and mix well to obtain the molding compound. Transfer it to molding at 175 ° C and 7MPa for 3 minutes, and cure it for 2 hours at 150 ° C. The shrinkage rate of the product during primary molding is 0.07%, and the shrinkage rate during secondary curing is 0 12%, bending strength 109MPa, coefficient of thermal expansion 0.3Xl0 5/° C.
Modified phenolic resin molding compounds with good hydrophobicity and impact resistance can be prepared by the following method, ­ Take. For example, 100 parts of HMe core 0 (Me core 0) core Me2H were first reacted with 60 parts of CH2=CHCH2O O-CMe2-0OCH formula H=CH2 under lead catalysis to obtain hydrosilylation addition products. Take 30 portions of the product, add 100 portions of PhOH, 65 portions of 37% HCHO, and 1 portion of oxalic acid (COOH) 2, and react to obtain a silica fired modified linear phenolic resin. Take out 40 parts of the product, mix in 8 parts of hexamethylene tetramine, 50 parts of glass fiber, 1 part of lubricant, 1 part of pigment, and 0 5 parts of amino silicon fired coupling agent to obtain molded plastic. By transferring and molding it, the bending strength of the test piece can reach 190 MPa, the bending elongation is 2.0%, and the impact strength of the simply supported beam is 4 After soaking in water at 100 ° C for 500 hours, OkJ/m gas only gained 1.1% weight.

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