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Application of Modified Epoxy Resin

May 23, 2023

Phenolic epoxy ECN was modified with OMS and DPS respectively, with an OMS dosage of 5 At 7g, Tg reaches 161.83 ° C and Is reaches 14 OkJ/mV increased by 15% compared to unmodified ones At 43 ° C and 8kJ/m2, when modified with DPS of different qualities, the stone showed varying degrees of decrease. This is because ECN has a high polarity and poor compatibility with large molecules. At this time, only small molecules can achieve better modification effects.

By reacting the end group chlorine with the light group on the epoxy chain to generate a large bond energy Sl-0 bond, not only does it not consume the epoxy group, but also increases the crosslinking density of the cured resin. This not only toughens the resin, but also improves its heat resistance, impact resistance, and other properties.

The pre reaction of polydimethylsiloxane with an average molecular weight of 1400 with ortho cresol epoxy resin was carried out, and then mixed with a phenolic resin curing agent before molding. The pre reaction improved the dispersion of polysiloxane in the epoxy resin system.
Epoxy molding compounds are modified with epoxy terminated polysiloxane. The epoxy terminated polydimethylsiloxane first reacts with the curing agent of the epoxy resin to form a block copolymer, which is then mixed with the epoxy resin to make the distribution of polysiloxane more uniform and the phase size smaller.

React with methacrylic acid using o-cresol linear phenolic vinegar epoxy resin to introduce vinyl groups. The research results indicate that the stone is basically not affected by the vinyl side chain polysiloxane, with a decrease in elastic modulus and a significant increase in bending strength.

A study was conducted on the modification of epoxy resin with reactive polydimethylsiloxane oligomers, and it was found that even if the relative molecular weight of polydimethylsiloxane oligomers is low (with a relative molecular weight of 500 or only 5 Si O repeating units), their compatibility is still not ideal. The expected improvement in tensile and impact strength was achieved using 1,3-diaminopropyl polymethylsiloxane as a model curing agent and modifier for epoxy resin, but the silicon content increased and the glass transition temperature decreased.

Firstly, the reaction of a, cylinder disulfide polydimethylsiloxane (DHS) and dichlorodimethylsiloxane (DMS) in toluene is carried out to obtain G, cylinder disulfide polydimethylsiloxane (DPS). The HCI gas generated during the reaction is absorbed by triethylamine.
Then, different compositions of chloroorganosilicon were reacted with bisphenol A epoxy resin E-44 in toluene, and the HCI gas generated during the reaction was absorbed with triethylamine. After the reaction is completed, the solution is washed several times with distilled water to remove the quaternary salt. Then, the solution is evaporated under reduced pressure to remove toluene and obtain the product modified resin.

The results showed that with the increase of small molecule dosage, the impact strength (Is), glass transition temperature (Tg), tensile strength (81), and elongation at break (c) of the cured product were significantly improved by modifying epoxy resin E-44 with OMS, reaching 167 98 ° C, which is 32% higher than unmodified resin C135 (42 ° C) At 56 ° C, Is and c have nearly doubled, and 81 have increased by 46%. This is because small molecule organosilicon is bonded in the epoxy cross-linking network through chemical bond, which increases the cross-linking density and molecular halo. At the same time, the Si-0 bond energy generated is large, and the Si-C bond can rotate. TMS has only one end bonded, so the modification effect is not as good as OMS. This fully shows that this modification is a reaction between the tibial group and the chlorine terminal group, forming a chemical bond.

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