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Classification of Silicone Resins-Distinguish According to Curing Conditions

Mar 17, 2023

According to different conditions of curing reaction, it can be divided into four types as shown in Table, such as heating curing type, low temperature (room temperature) drying type, low temperature (room temperature) curing type, ultraviolet curing type, etc.

Classification according to curing conditions





Heat curing

Good adhesion with base material and electrical specificity

Equipment costs need to be increased, and it is difficult to use fine electronic components

Heat-resistant coating, laminate, adhesive, sleeve, coil impregnation

Air drying

No heating equipment required, applicable to electronic components

It just doesn't peel off and the curing is incomplete

Paint for electrical and electronic components and equipment

Room temperature curing

Curing without heating equipment

Strict airtight reporting is required

Paint for electrical and electronic components


Rapid curing, solvent-free

Poor adhesion

Packaging of electronic components and precision instruments

The most common method is to start the curing reaction by heating it. The dehydration condensation reaction starts slowly at around 100 ° C. In order to achieve practical speed, organic metal salts such as Pb, Sn, Zn, Fe, and other amines must be used as curing catalysts and heated to above 150 ° C, while heating to 200 ° C is required to complete the reaction. By heating the curing reaction, the melting viscosity of the uncured resin can be reduced, the micro voids on the surface of the substrate can be sealed, the adhesive force with the substrate can be improved, and low molecular volatile substances that can cause thermal softening and electrical property degradation can be removed, resulting in the preparation of stable cured resin. However, because there are too many types of coating substrates, and some cannot withstand high temperature heating treatment, it is now seeking low-temperature curing types at ambient temperatures to around 100 ° C. Normal temperature drying type is mainly used for moisture-proof coating of electronic components, or waterproof treatment of building materials. This type of coating only volatilizes the solvent on the surface of the coating, forming a non peeling coating film. Due to the absence of a true curing reaction, if the coating film is heated, brought into contact with the solvent, or soaked in boiling water, they will dissolve or peel off, losing their original function.

In contrast, there are two types of room temperature curing type. One is the so-called two-component type, in which the curing agent is added before use to make the curing reaction slowly at room temperature; The other is a one-component type containing curing accelerator, which uses water and oxygen in the air and carbon dioxide to make it undergo curing reaction. The former, for example, can be used to cure the silicone resin with epoxy group at room temperature by amine or isobaric acid compound. For the latter, if functional groups that are easy to hydrolyze are introduced into the molecular structure, such as the oxy groups such as OCH3 and OC2Hs, and the acyloxy groups such as OCOC pressure, and tin compounds are added as hydrolysis promoters, they will cause the reactions of deacetylation, deacetylation, and degrease respectively when they meet with water, and generate new silica bonds. In addition, there are also oxidation polymerization reaction using unsaturated alkyd resin modified type and decarbonation curing reaction using CO2 from SiOna's basic alkoxide. In short, compared with the heating curing reaction, although the reaction time needs to be increased, heating equipment is not required; Compared with the normal temperature drying type, its advantage is that it can obtain excellent coating film. However, it must be kept strictly closed and absolutely moisture-proof.

The recently developed UV-curing type is cured by ultraviolet and electron beam irradiation, so its biggest advantage is fast curing, and its curing time is calculated in seconds and minutes. When curing with electron beam radiation, because the curing must be carried out under vacuum or inert gas conditions, the equipment cost required is relatively high, and it is said that it is rarely practical. Although the use of ultraviolet radiation has achieved practical application in the coating or packaging of electronic components, due to the fact that the inner side of the irradiated body and other parts that cannot be exposed to light cannot be cured, full attention must be paid to it. In addition, due to the rapid curing rate, if the film is too hard, it will cause curing deformation, resulting in poor adhesion and cracking, so the film must be a soft structure.

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